News

2019-11-05 07:45:54Determination of the transport properties in 4H-SiC wafers by Raman scattering measurement*
2019-10-29 01:24:43Design and fabrication of high performance wafer-level vacuum packaging based on glass–silicon–glass bonding techniques
2019-10-21 01:59:50Electronic excitation of P-state of cadmium and zinc atoms
2019-09-27 06:24:45Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD) germanium buffer layer
2019-09-18 06:27:20Study on annealing experiment of AlGaInP - based LED wafer by electron beam irradiation
2019-09-12 02:12:37Comparative studies of monoclinic and orthorhombic WO3 films used for hydrogen sensor fabrication on SiC crystal
2019-08-28 03:55:21Sub-Pitch Spatial Resolution in CZT Detectors: Simulation Study
2019-08-19 08:49:54Increased upper critical field for nanocrystalline MoN thin films deposited on AlN buffered substrates at ambient temperature
2019-08-12 07:51:38Hydrogen Implantation and Annealing-Induced Exfoliation Process in SiC Wafers with Various Crystal Orientations
2019-08-06 01:49:02Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as an etching mask