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Low dark current and internal gain mechanism of GaN MSM photodetectors fabricated on bulk GaN substrate

Metal-semiconductor–metal ultraviolet photodetectors are fabricated on low-defect-density homoepitaxial GaN layer on bulk GaN substrate. The dislocation density of the homoepitaxial layer characterized by cathodoluminescence mapping technique is 5 × 106 cm−2. The photodetector with a high UV-to-visible rejection ratio of up to 1 × 105 exhibits a low dark current of <2 pA at room temperature under 10 V bias. The photo-responsivity of the photodetector gradually increases as a function of applied bias, resulting in a photodetector quantum efficiency exceeding 100% at above medium bias. The photo-responsivity also shows a dependence on the incident optical power density and illumination conditions. The internal gain mechanism of the photodetector is attributed to photo-generated holes trapped at the semiconductor/metal interface as well as high-field-induced image-force lowering effect.
Research highlights
► MSM UV photodetectors are fabricated on low-defect-density homoepitaxial GaN layer.
► The photodetector exhibits ultra-low dark current and high UV/visible rejection ratio.
► The internal gain is attributed to hole trapping at interface and image-force lowering effect.
 Photo of interdigitated GaN MSM photodetector and panchromatic CL Mapping...
Fig. 1. (a) Photograph of an interdigitated GaN MSM photodetector and (b) panchromatic CL mapping image of the homoepitaxial GaN layer grown on bulk GaN substrate.
 
Source: Solid-State Electronics
 
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