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AlN on Sapphire Substrate
2”AlN Epitaxy on Sapphire Templates
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Item
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PAM-AlNT-SI
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Conduction Type
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semi-insulating
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Diameter
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Ф 50.8mm ± 1mm
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Thickness:
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(30nm-5um)+/- 10%
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Substrate:
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sapphire
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Orientation :
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C-axis(0001)+/-1O
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Orientation Flat
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A-plane
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XRD FWHM of (0002)
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<200 arcsec.
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Useable Surface Area
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≥90%
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Polishing:
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Single side Polished,epi-ready
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PROPERTY / MATERIAL
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Cubic (Beta) AlN
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Hexagonal (Alpha) AlN
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.
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.
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.
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Structure
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Zinc Blende
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Wurzite
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Space Group
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F bar4 3m
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C46v ( = P63mc)
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Stability
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Meta-stable
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Stable
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Lattice Parameter(s) at 300K
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0.436 nm
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a0=0.3111 nm
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c0 = 0.4978 nm
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Density at 300K
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3.285 g.cm-3
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3.255 g.cm-3
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Elastic Moduli at 300 K
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. . .
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. . .
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Linear Therm. Expansion Coeff.
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. . .
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Along a0: 5.3x10-6 K-1
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at 300 K
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Along c0: 4.2x10-6 K-1
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Calculated Spontaneous Polarisations
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Not Applicable
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– 0.081 C m-2
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Bernardini et al 1997
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Bernardini & Fiorentini 1999
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Calculated Piezo-electric Coefficients
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Not Applicable
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e33 = + 1.46 C m-2
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e31 = – 0.60 C m-2
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Bernardini et al 1997
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Bernardini & Fiorentini 1999
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Phonon Energies
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. . .
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. . .
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. . .
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Units: Wcm-1K-1
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.
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.
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Thermal Conductivity
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Tansley et al 1997b
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near 300K
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.
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3.0 to 3.3
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for thick, free-standing AlN
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Florescu et al, 2001
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Melting Point
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. . .
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. . .. K
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Dielectric Constant
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. . .
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Mean = 9.14
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at Lowish Frequency
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Refractive Index
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. . .
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2.15±0.05 at 3eV
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Tansley et al 1997b
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Nature of Energy Gap Eg
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Direct
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Direct
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Energy Gap Eg at 300 K
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. . . eV
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6.2 eV
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Yoshida et al 198
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Vurgaftman et al (2001)
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Energy Gap Eg at 5 K
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. . .
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6.28 eV
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Vurgaftman et al (2001)
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Intrinsic Carrier Conc. at 300 K
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. . .
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. . .
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Ionisation Energy of . . . Donor
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. . . .
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. . .
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Electron Mobility at 300 K
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. . .
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. . .
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for n= . .
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Electron Mobility at 77 K
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. . . .
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. . .
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for n= . .
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Ionisation Energy of . . . Acceptor
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. . .
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. . .
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Hole Mobility at 300 K
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. . . .
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. . . .
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for p= . .
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Hole Mobility at 77 K
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. . . .
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. . .
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for p=. . .
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.
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Cubic (Beta) AlN
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Hexagonal (Alpha) AlN
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